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About The Book
Description
Author
<p>In the More than Moore era performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.</p>
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Assured Quality
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*COD & Shipping Charges may apply on certain items.
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₹15182
₹19553
22% OFF
Hardback
Out Of Stock
All inclusive*
Details
ISBN 13
9781032528236
Publication Date
-28-06-2024
Pages
-462
Weight
-743 grams
Dimensions
-156x234x25.74 mm
